More than one thousand sets of IC tray molds to meet customers’ demands for all kinds of package types and sizes.
- Complying with JEDEC standards, professional product deign provides customers’ IC with best carrying and protection.
- Integrated mold manufacturing and production provide the fastest sample delivery and service for customers.
- Strict quality management provides the best product quality for customers.
- Maximum baking temperature : 180/150/135 ºC
- Surface resistivity : 1x105~1x1012 ohms/square
- Package types : BGA, TFBGA, FCBGA, QFN, QFP, LQFP, TQFP, TSOP, SOP, SIP and CIS
End-cap & Clip-tab
A plastic clip-tab for IC tray enables to identify and classify different test BIN of IC. It has a variety of colours and printing choices.