1. More than one thousand sets of IC tray molds to meet customers’ demands for all kinds of package types and sizes.
2. Complying with JEDEC standards, professional product deign provides customers’ IC with best carrying and protection.
3. Integrated mold manufacturing and production provide the fastest sample delivery and service for customers.
4. Strict quality management provides the best product quality for customers.
5. Maximum baking temperature : 180/150/135 ºC
6. Surface resistivity : 1x10⁵~1x10¹² ohms/square
7. Package types : BGA, TFBGA, FCBGA, QFN, QFP, LQFP, TQFP, TSOP, SOP, SIP and CIS

End-cap & Clip-tab

A plastic clip-tab for IC tray enables to identify and classify different test BIN of IC. It has a variety of colours and printing choices.